Vacuum Pads

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

Suitable for handling spherical or inclined workpieces

Appropriate for workpieces with curved surfaces

For the adsorption of small components such as IC chips

Tailored for long and narrow workpieces with adsorption surface limitations

For workpieces with bumps

Suitable for the adsorption of circular components like CDs and DVDs

To be used for the adsorption and holding of the stage of panels, glass circuit boards, etc.

• Accessories for ZP2

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

For spherical workpieces or workpieces with inclined surfaces

Appropriate for workpieces with curved surfaces

Tailored for long and narrow workpieces with adsorption surface limitations

For the adsorption of small components such as IC chips

For workpieces with bumps

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

Appropriate for workpieces with curved surfaces

Tailored for long and narrow workpieces with adsorption surface limitations

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

Appropriate for workpieces with curved surfaces

Tailored for long and narrow workpieces with adsorption surface limitations

• Integration of ejector and pad in a single compact unit.
• Lock-plate structure that enables easy, one-touch replacement of the pad.
• More efficient two-stage ejector mounted, with improved vacuum generation efficiency: suction flow rate increased by 50 %, and air consumption reduced by 30 %.
• Through-hole silencer placed in the release, thus discharging directly to atmosphere - noise reduced and clogging minimised.
• 3 port locations available in the adapted pad, allowing for variety of connections and for daisy-chain piping.